Coverage ranges from thermal properties and semiconductor materials to mosfets , digital logic families , memory devices , microprocessors , digital - to - analog and analog - to - digital converters , digital filters , and multichip module technology 覆蓋范圍從熱性能和半導(dǎo)體材料的mosfet ,數(shù)字邏輯家庭,記憶體裝置,微處理器,數(shù)位類比和模擬到數(shù)字轉(zhuǎn)換器,數(shù)字濾波器,以及多芯片組件技術(shù)。
Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density 多芯片組件( mcm )是微電子封裝的高級(jí)形式,它是把裸芯片與微型元件組裝在同一個(gè)高密度布線基板上,組成能夠完成一定的功能的模塊甚至子系統(tǒng)。